Showing results: 61 - 75 of 113 items found.
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3954 -
Technobox, Inc.
The extender/analysis probe permits extension of a PMC card beyong the edge of a host processor front panel, providing access to both Side 1 and Side 2 of a PMC under test.
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EB Series -
EverBeing Int'l Corp
Comprehensive prober for DC and RF. The EB series contains features to step-up your usability to acquire the accurate data you need from your devices. It has a built in probe card slot.
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LSR-3230 -
W.M. Hague Company
* no fixture or probe cards on top side * 2, 4, and 6 wire test capability * touch screen operation * high performance DC electrical tester * high throughput - low running cost
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Extech SD200 -
Extech Instruments Corporation
The SD200 is a 3-Channel Temperature Datalogger. Records data on an SD card in Excel format. Selectable data sampling rate of 5, 10, 30, 60, 120, 300, 600 seconds or Automatic. Complete with six AAA batteries, 2G SD card, universal AC Adaptor, three Type-K bead wire temperature probes and mounting bracket.
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MS-100D -
CST Inc.
MS-100D has a very good architecture, with different probe card the same tester is able to test almost all DRAM DIE on the market, specially Mobile Low Power DRAM: LPDDR2, LPDDR3 & LPDDR4.
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OCP NIC 3.0 -
Teledyne LeCroy
The Summit product family includes a wide variety of Interposer systems, designed to reliably capture serial data traffic while minimizing perturbations in the serial data stream. Probes include interposers, which are designed to capture data traffic crossing the PCI Express card connector interface, and MidBus probes, which are designed to capture traffic flowing within a PCB.
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Teledyne LeCroy
The Summit product family includes a wide variety of Interposer systems, designed to reliably capture serial data traffic while minimizing perturbations in the serial data stream. Probes include interposers, which are designed to capture data traffic crossing the PCI Express card connector interface, and MidBus probes, which are designed to capture traffic flowing within a PCB.
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MANAGER -
Beijert Engineering BV
Today more complex probe cards are being used. More pins,higher density and larger array requires a new approach inprobe card analysis. With the soaring cost of new generationprobe cards, repair of defective cards becomes an necessity.BE Precision Technology offers all capabilities with the newMANAGER V. Future proof, up to 450 mm full wafer contactprobe cards can be analyzed with up to 88.000 test channels.High-end materials are used to stand extra tough requirements—such as 500 mm diameter diamante viewing window,ultra stiff carbon flip-table, high power Z–stage to generate 600Kg of contact force
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Extech SDL200 -
Extech Instruments Corporation
The SDL200 records data on an SD card in Excel format. 4-Channel datalogging with 6 Thermocouple types (J, K, E, T, R,S) and 2-Channel datalogging with RTD (Pt100Ohm) probes. Displays [T1, T2, T3, T4] or differential [T1-T2] readings. Offset adjustment used for zero function to make relative measurements. Stores 99 readings manually and 20M readings via 2G SD card. Records readings with real date and time stamp. User programmable sampling rate from 1 to 3600 seconds. Min/Max, Data Hold, Auto Power Off. Complete with 6 AA batteries, four general purpose Type K bead wire temperature probes, SD card, and hard carrying case.
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Trio Vertical -
SV Probe, Inc.
SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Circuit Check, Inc.
Circuit Check supports reading linear bar codes and 2D symbols within each of its fixture product lines.When spring-loaded probes are not practical or access is limited, Circuit Check can help you with thru-connector tests to contact connectors on any surface or edge of a circuit board. These tests can be implemented spring probes, mating connectors, sacrificial SMT connectors, and stabber cards.
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N2115A -
Keysight Technologies
The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
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Celadon
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Medalist i1000 Systems -
Keysight Technologies
Cover Extend Technology (CET) is now supported on the Medalist i1000D. The i1000D only requires a VTEP MUX card to enable CET. If you are already using test fixtures with VTEP MUX cards , you can now implement CET without any fixture modification. Simply add new VTEP probes to devices that were previously not testable. This greatly reduces implementation efforts.
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STAr Technologies, Inc.
To meet the requirements on advanced semiconductor testing, STAr Technologies acquired the conductive elastomer interconnect technology and manufacturing capabilities from a leading probe card supplier and enables to provide high performance interposer and test sockets to industry customers.
